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    Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). By employing SMT, the production process speeds up, but the risk of defects also increase due the component miniaturization and to the denser packing of the boards.


Without lots of experience soldering surface mount components, the average assembler is challenged by the soldering process for surface mount. Unlike conventional assembly where larger parts are installed in a circuit board by placing leads thru plated holes and heated while the solder flows, mounting surface mount parts is like doing surgery, utilizing discrete component placement while soldering.


Most beginners share the same common mistakes during assembly that are not as forgiving as thru-hole soldering. Remember, those tiny surface mount parts are soldered onto small miniature pads that are only a few thousands thick. To much solder or heat and without warning, you will lift a pad or damage your component. And when it comes to rework, where that little pad(s) is heated once during the mistake, again to remove the part in question and again to reinstall that part, will make a seasoned assembler nervous. Prior to the soldering of any surface mount part, it is critical that you are using the right solder, flux, proper temperature soldering gun using a conical tip for pen-point accuracy and a microscope.

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